Welcome to RSM 2021

2021 IEEE Regional Symposium on Micro and Nanoelectronics 
( RSM 2021 )
2-4 August 2021


What’s new:

  1. Opening programNew
  2. UBS Live CD (includes Technical Program)
    (papers will be available from 31st July – 4th August
    2021)  
  3. USB proceedings will be available from 31st July – 4th August
    2021 to download
  4. Our Keynote speakers: Click HERE for details
  5. Sponsorship: Click HERE for details.

We are pleased to invite you to the 13th  2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM). This bi-annual technical conference since 1997 aims at bringing together researchers from industry and academia to gather and explore various issues and trends in the field of semiconductor electronics. This is the 13th RSM organized by the Electron Devices Chapter of IEEE Malaysia Section and technically co-sponsored by the IEEE Electron Devices Society. Over the last eighteen years, the RSM conference series has become the prominent international forum on semiconductor electronics embracing all aspects of the semiconductor technology from circuit device, modelling and simulation, photonics and sensor technology, MEMS technology, process and fabrication, packaging technology and manufacturing, failure analysis and reliability, material and devices and nanoelectronics.

Registered and presented paper will be submitted for inclusion in the IEEE Xplore database.

Information regarding IEEE Xplore database for 2021 IEEE RSM 

2021 RSM Proceedings IEEE CATALOG NUMBERS

Media Type Part Number ISBN Online ISBN
 XPLORE COMPLIANT CFP2168N-ART 978-1-6654-1232-2 2639-4642
 USB CFP2168N-USB 978-1-6654-1231-5


Pervious IEEE Xplore proceedings

https://ieeexplore.ieee.org/xpl/conhome/1800578/all-proceedings

2019 https://ieeexplore.ieee.org/xpl/conhome/8931667/proceeding

2017  https://ieeexplore.ieee.org/xpl/conhome/8062165/proceeding

2015 https://ieeexplore.ieee.org/xpl/conhome/7337633/proceeding

2013 https://ieeexplore.ieee.org/xpl/conhome/6685220/proceeding

2011 https://ieeexplore.ieee.org/xpl/conhome/6086117/proceeding


Organized by 

SUBMIT PAPER